Dear Bloggggg1111.Grouponbk,
Good day.
This is a courtesy email to let you know that in order to obtain the ideal signal quality and transmission characteristics, high speed USB2.0 device usually requires the stacked layers of PCB is at least 4 layer. An option can be selected is Signal-GND-VCC-Signal. For a simple USB bus, it also can be designed as double sided.
Here's an example of 90 ohm differential impedance controlled PCB for USB.
1) FR-4 TG>130
2) 17.5um initial copper, 1.1mm finished thick
3) L1/L2 30/10 mil 90 ohm+/-10%
4) Immersion gold finish
5) Stack up
---------- OVERLAY (TOP) .GTO
--- ---------- SOLDER MASK (TOP) .GTS
| ---------- LAYER 1 (TOP LAYER) .GTL
1.1mm DIELECTRIC (FR-4 core)
| ---------- LAYER 2 (BOTTOM LAYER) .GBL
--- ---------- SOLDER MASK (BOTTOM) .GBS
If you have requirement on these PCB's, please reply back to this email or following contact by your gerber files and we will get back to you asap.
Ruth Huang | Business development
Bicheng PCB |(86-755-21949341 | www.bicheng-pcb.com | sales12@bicheng-pcb.com
If you do not want to receive emails from Bicheng about marketing communications, reply as "remove" in the subject line.
Bicheng is located at Baoan, Shenzhen, China 51803.
संदेश
